Babban abin da ake amfani da shi a cikin PCBs shinefoil na jan karfe, wanda ake amfani dashi don watsa sigina da igiyoyi. A lokaci guda kuma, ana iya amfani da foil ɗin tagulla akan PCBs azaman jirgin sama don sarrafa tasirin layin watsawa, ko azaman garkuwa don murkushe tsangwama na lantarki (EMI). A lokaci guda, a cikin PCB masana'antu tsari, da kwasfa ƙarfi, etching yi da sauran halaye na jan karfe tsare zai kuma shafi inganci da amincin PCB masana'antu. Injiniyoyin Layout na PCB suna buƙatar fahimtar waɗannan halayen don tabbatar da cewa ana iya aiwatar da aikin kera PCB cikin nasara.
Rufin jan karfe don allon da'ira da aka buga suna da foil na jan ƙarfe na lantarki (electrodeposited ED jan karfe foil) da foil na tagulla da aka toshebirgima annealed RA tagulla foil) nau'i biyu, na farko ta hanyar hanyar samar da lantarki, na biyu ta hanyar birgima na masana'antu. A cikin PCBs masu tsauri, ana amfani da foils na jan ƙarfe na electrolytic, yayin da aka yi amfani da foils ɗin jan ƙarfe da aka toshe ana amfani da su don sassauƙan allon allo.
Don aikace-aikace a cikin allunan da'ira da aka buga, akwai babban bambanci tsakanin foil ɗin tagulla na electrolytic da calended. Foil ɗin tagulla na electrolytic yana da halaye daban-daban akan saman su biyu, watau, rashin daidaituwar saman biyu na foil ɗin ba ɗaya bane. Yayin da mitocin da'irar ke ƙaruwa, ƙayyadaddun halaye na foils na jan karfe na iya yin tasiri ga mitar millimeter wave (mm Wave) da da'irar dijital mai sauri (HSD). Ƙunƙarar rufin jan ƙarfe na iya shafar asarar shigar PCB, daidaituwar lokaci, da jinkirin yaduwa. Ƙunƙarar bangon jan ƙarfe na iya haifar da bambance-bambancen aiki daga PCB ɗaya zuwa wani da kuma bambancin aikin lantarki daga wannan PCB zuwa wancan. Fahimtar aikin foils na jan karfe a cikin babban aiki, da'irori masu sauri na iya taimakawa haɓakawa da daidaita tsarin ƙira daga ƙira zuwa ainihin kewaye.
Ƙunƙarar saman bangon jan karfe yana da mahimmanci ga masana'antar PCB
Siffar yanayin da ba ta dace ba tana taimakawa wajen ƙarfafa mannewar foil ɗin tagulla zuwa tsarin guduro. Duk da haka, bayanin martaba mafi ƙanƙanta na iya buƙatar lokaci mai tsayi, wanda zai iya shafar aikin hukumar da daidaiton ƙirar layi. Ƙara lokacin etching yana nufin ƙãra etching na kai tsaye na madugu da mafi tsanani ta gefen madubin. Wannan yana sa ƙirar layi mai kyau da sarrafa impedance mafi wahala. Bugu da kari, tasirin taurin foil na jan karfe akan raguwar sigina ya bayyana yayin da mitar da'ira ke karuwa. A mafi girma mitoci, ƙarin sigina na lantarki ana watsa su ta saman madubin, kuma ƙasa mai daɗaɗawa yana haifar da siginar tafiya mai nisa, yana haifar da ƙara ko asara. Don haka, manyan abubuwan da ake yi suna buƙatar ƙarancin tarkace tagulla tare da isassun mannewa don dacewa da tsarin guduro mai girma.
Ko da yake mafi yawan aikace-aikace akan PCBs a yau suna da kauri na jan karfe na 1/2oz (kimanin 18μm), 1oz (kimanin 35μm) da 2oz (kimanin 70μm), na'urorin hannu suna ɗaya daga cikin abubuwan tuƙi don kaurin tagulla na PCB don zama bakin ciki kamar bakin ciki. 1μm, yayin da a gefe guda kuma kaurin jan karfe na 100μm ko fiye zai sake zama mahimmanci saboda sabbin aikace-aikacen (misali na'urorin lantarki, hasken LED, da sauransu). .
Kuma tare da haɓaka raƙuman ruwa na milimita 5G da kuma hanyoyin haɗin yanar gizo masu sauri, buƙatar foils na jan karfe tare da ƙananan bayanan martaba yana karuwa a fili.
Lokacin aikawa: Afrilu-10-2024